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MC74HC373A Octal 3-State Non-Inverting Transparent Latch
High-Performance Silicon-Gate CMOS
The MC74HC373A is identical in pinout to the LS373. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. These latches appear transparent to data (i.e., the outputs change asynchronously) when Latch Enable is high. When Latch Enable goes low, data meeting the setup and hold time becomes latched. The Output Enable input does not affect the state of the latches, but when Output Enable is high, all device outputs are forced to the high-impedance state. Thus, data may be latched even when the outputs are not enabled. The HC373A is identical in function to the HC573A which has the data inputs on the opposite side of the package from the outputs to facilitate PC board layout. The HC373A is the non-inverting version of the HC533A.
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20 PDIP-20 N SUFFIX CASE 738
1
MC74HC373AN AWLYYWW 1 20
20
20 1
SOIC WIDE-20 DW SUFFIX CASE 751D 1 TSSOP-20 DT SUFFIX CASE 948G
HC373A AWLYYWW 20 HC 373A ALYW 1
* * * * * * *
Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A Chip Complexity: 186 FETs or 46.5 Equivalent Gates
20 1
A WL YY WW
= Assembly Location = Wafer Lot = Year = Work Week
ORDERING INFORMATION
Device MC74HC373AN MC74HC373ADW MC74HC373ADWR2 MC74HC373ADT MC74HC373ADTR2 Package PDIP-20 SOIC-WIDE SOIC-WIDE TSSOP-20 TSSOP-20 Shipping 1440 / Box 38 / Rail 1000 / Reel 75 / Rail 2500 / Reel
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 8
Publication Order Number: MC74HC373A/D
MC74HC373A
PIN ASSIGNMENT
OUTPUT ENABLE Q0 D0 D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 3 4 7 8 13 14 17 18 2 5 6 9 12 15 16 19 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 PIN 20 = VCC PIN 10 = GND Output Enable NONINVERTING OUTPUTS D1 Q1 Q2 D2 D3 Q3 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC Q7 D7 D6 Q6 Q5 D5 D4 Q4 LATCH ENABLE
LOGIC DIAGRAM
FUNCTION TABLE
Inputs Latch Enable D H L X X Output Q H L No Change Z
LATCH ENABLE OUTPUT ENABLE
11 1
L H L H L L H X X = Don't Care Z = High Impedance
III I I IIIIIIIIIIIIIIII II III I I IIIIIIIIIIIIIIII II IIIIIIIIIIIIIIII II IIIIIIIIIIIIIIII IIIIIIIIIIIIII IIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIII II IIIIIIIIIIIIIIII II IIIIIIIIIIIIIIII IIIIIIIIIIIIII I
Design Criteria Value 46.5 1.5 5.0 Units ea ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product W pJ 0.0075 *Equivalent to a two-input NAND gate.
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MC74HC373A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I III I I I I I II I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIII III I II I I IIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII II I IIII I II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I
IIIIIIIIIIIIIIIIIIII II I IIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I II II I I I IIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIII II I II I I III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I III II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
SymbolIIIIIIIIIIIIII Parameter VCC Vin DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) Value Unit - 0.5 to + 7.0III V V V - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 35 75 750 500 450 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP SOIC Package TSSOP Package mW Tstg TL Storage Temperature - 65 to + 150 260
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
v
v
_C _C
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC, SSOP or TSSOP Package)
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter Min 2.0 0 Max 6.0 Unit V V
DC Supply Voltage (Referenced to GND)
Vin, Vout TA
DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1)
VCC
- 55 0 0 0
+ 125 1000 500 400
_C
ns
tr, tf
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol VIH
Parameter
Test Conditions
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0
- 55 to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
v 85_C v 125_C
1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.2 3.7 5.2 0.1 0.1 0.1 0.4 0.4 0.4
Unit V
Minimum High-Level Input Voltage
Vout = VCC - 0.1 V |Iout| 20 A
v v v
VIL
Maximum Low-Level Input Voltage
Vout = 0.1 V |Iout| 20 A
V
VOH
Minimum High-Level Output Voltage
Vin = VIH |Iout| 20 A Vin = VIH
V
|Iout| |Iout| |Iout|
v 2.4 mA v 6.0 mA v 7.8 mA v 2.4 mA v 6.0 mA v 7.8 mA
2.48 3.98 5.48 0.1 0.1 0.1
2.34 3.84 5.34 0.1 0.1 0.1
VOL
Maximum Low-Level Output Voltage
Vin = VIL |Iout| 20 A
v
V
Vin = VIL
|Iout| |Iout| |Iout|
0.26 0.26 0.26
0.33 0.33 0.33
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MC74HC373A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I II I I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I II I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIII I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII I II II I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I III I I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I
Guaranteed Limit Symbol Iin Parameter Test Conditions VCC V 6.0 6.0 - 55 to 25_C 0.1 0.5
v 85_C v 125_C
1.0 5.0 1.0 10
Unit A A
Maximum Input Leakage Current Maximum Three-State Leakage Current
Vin = VCC or GND
IOZ
Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0 A
ICC
Maximum Quiescent Supply Current (per Package)
6.0
4.0
40
160
A
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
Symbol tPLH tPHL
Parameter
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0
- 55 to 25_C 125 80 25 21 140 90 28 24 150 100 30 26 150 100 30 26 60 23 12 10 10 15
v 85_C v 125_C
155 110 31 26 175 120 35 30 190 125 38 33 190 125 38 33 75 27 15 13 10 15 190 130 38 32 210 140 42 36 225 150 45 38 225 150 45 38 90 32 18 15 10 15
Unit ns
Maximum Propagation Delay, Input D to Q (Figures 1 and 5)
tPLH tPHL
Maximum Propagation Delay, Latch Enable to Q (Figures 2 and 5)
ns
tPLZ tPHZ
Maximum Propagation Delay, Output Enable to Q (Figures 3 and 6)
ns
tPZL tPZH
Maximum Propagation Delay, Output Enable to Q (Figures 3 and 6)
ns
tTLH tTHL
Maximum Output Transition Time, Any Output (Figures 1 and 5)
ns
Cin
Maximum Input Capacitance
pF pF
Cout
Maximum Three-State Output Capacitance (Output in High-Impedance State)
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V 36
CPD
Power Dissipation Capacitance (Per Enabled Output)*
pF
* Used to determine the no-load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
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II I I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII IIIIIIII I I II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII IIIIIIII I I II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII I I II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III IIIII I II I I I I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII I IIIIIIIIIIIIII IIIIIIIIIIIIIIIIII IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
TIMING REQUIREMENTS (CL = 50 pF, Input tr = tf = 6.0 ns)
SymbolIIIIIIIIIIIII Fig. Parameter tr, tf tsu tw th Maximum Input Rise and Fall Times Minimum Pulse Width, Latch Enable Minimum Hold Time, Latch Enable to Input D Minimum Setup Time, Input D to Latch Enable
OUTPUT ENABLE
INPUT D
Q
Q
Q
tPLH
tr
tTLH
50%
50%
1.3 V
90% 50% 10%
90% 50% 10%
Figure 3.
Figure 1.
tPZL
tPZH
tPHZ
tPLZ
tf
10%
90%
tPHL
tTHL
SWITCHING WAVEFORMS
HIGH IMPEDANCE
VOH
VOL
HIGH IMPEDANCE
GND
VCC
GND
VCC
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MC74HC373A
1
2
4
4III 2.0 3.0 4.5 6.0
5 LATCH ENABLE LATCH ENABLE VCC Volts 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 INPUT D - 55 to 25_C Min Q 5.0 5.0 5.0 5.0 25 20 5.0 5.0 60 23 12 10 1000 800 500 400 MaxIII Min Max 50% 50% Guaranteed Limit tw tPLH
Figure 4.
50% 5.0 5.0 50 5.0 30 25 6.0 6.0 75 27 15 13
Figure 2.
v 85_C
tsu
1000 800 500 400
VALID
tPHL
50% Min th 5.0 5.0 5.0 5.0 40 30 8.0 7.0 90 32 18 15
v 125_C
1000 800 500 400
Max
GND
VCC
Unit
GND
GND VCC VCC ns ns ns ns
MC74HC373A
TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST TEST POINT OUTPUT CL* 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH.
CL*
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 5.
Figure 6.
EXPANDED LOGIC DIAGRAM
D0 3 D Q D1 4 D Q D2 7 D Q D3 8 D Q D4 13 D Q D5 14 D Q D6 17 D Q D7 18 D Q
LE 11
LE
LE
LE
LE
LE
LE
LE
1 2 Q0 5 Q1 6 Q2 9 Q3 12 Q4 15 Q5 16 Q6 19 Q7
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MC74HC373A
PACKAGE DIMENSIONS
PDIP-20 N SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E
11
-A-
20
B
1 10
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
SO-20 DW SUFFIX CASE 751D-05 ISSUE F
D A
11 X 45 _
q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
H
M
B
M
20
10X
0.25
E
1
10
h
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
DIM A A1 B C D E e H h L
L
18X
e
A1
q
T
C
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MC74HC373A
PACKAGE DIMENSIONS
20X
K REF
M
TSSOP-20 DT SUFFIX CASE 948E-02 ISSUE A
TU
S
0.15 (0.006) T U
S
0.10 (0.004)
V
S
K K1
2X
L/2
L
PIN 1 IDENT 1 10
B -U-
J J1
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
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IIII IIII IIII
SECTION N-N M DETAIL E DETAIL E
20
11
0.25 (0.010)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
-W-
DIM A B C D F G H J J1 K K1 L M
MC74HC373A/D

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Price & Availability of MC74HC373A

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